EPIC Meeting at Ligentec

This event aims to bridge the gap between photonic integrated circuit (PIC) developers and end users, fostering collaborations that will drive advancements in this cutting-edge field. Attendees will delve into the latest trends and technologies, focusing on the integration of various photonic components into a unified platform to meet the demands of emerging applications.

Key topics will include the development of high-performance photonic devices, novel materials for enhanced functionality, and scalable manufacturing processes. Discussions will cover silicon photonics as well as other materials platforms such as III-V semiconductors, lithium niobate, polymers, and more, highlighting their potential to revolutionize sectors beyond optical communications, such as sensing, and computing. Participants will also address the challenges of scaling up p

This event aims to bridge the gap between photonic integrated circuit (PIC) developers and end users, fostering collaborations that will drive advancements in this cutting-edge field. Attendees will delve into the latest trends and technologies, focusing on the integration of various photonic components into a unified platform to meet the demands of emerging applications.

Key topics will include the development of high-performance photonic devices, novel materials for enhanced functionality, and scalable manufacturing processes. Discussions will cover silicon photonics as well as other materials platforms such as III-V semiconductors, lithium niobate, polymers, and more, highlighting their potential to revolutionize sectors beyond optical communications, such as sensing, and computing. Participants will also address the challenges of scaling up p


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1. 2 µm ultrafast lasers for manufacturing
Host: Celia Millon
12-03-2025 15:45 - 16:30
Available meetings:  2
Requested meetings:  0
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3. Material bottlenecks in PIC
Host: Carsten Fritzsch
12-03-2025 15:45 - 16:30
Available meetings:  1
Requested meetings:  0
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8. Ultra Low Loss (ULL) Interconnects
Host: Régis Blin
12-03-2025 15:45 - 16:30
Available meetings:  1
Requested meetings:  0
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Ion beam processing of waveguides
Host: Manuela Lötsch
12-03-2025 15:45 - 16:30
Available meetings:  2
Requested meetings:  0
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2. Glass-Silicon E/O Interposers
Host: Giovanni Delrosso
12-03-2025 15:45 - 16:30
FULL
4. Optical interconnects
Host: Rolando Ferrini
12-03-2025 15:45 - 16:30
FULL
5. Photonics components automated micro-assembly
Host: Jean-Yves Bécel
12-03-2025 15:45 - 16:30
FULL
6. PIC packaging
Host: Nikola Prtljaga
12-03-2025 15:45 - 16:30
FULL
7. SWHL - Novel lithography for high-resolution 3D patterning
Host: Natasha Ivanova
12-03-2025 15:45 - 16:30
FULL
1. 2 µm ultrafast lasers for manufacturing
Host: Celia Millon
13-03-2025 10:15 - 11:00
Available meetings:  2
Requested meetings:  0
Request meeting
3. Optical interconnects
Host: Rolando Ferrini
13-03-2025 10:15 - 11:00
Available meetings:  1
Requested meetings:  0
Request meeting
4. Photonics components automated micro-assembly
Host: Jean-Yves Bécel
13-03-2025 10:15 - 11:00
Available meetings:  1
Requested meetings:  0
Request meeting
6. SWHL - Novel lithography for high-resolution 3D patterning
Host: Natasha Ivanova
13-03-2025 10:15 - 11:00
Available meetings:  2
Requested meetings:  0
Request meeting
7. Ultra Low Loss (ULL) Interconnects
Host: Régis Blin
13-03-2025 10:15 - 11:00
Available meetings:  1
Requested meetings:  0
Request meeting
Ion beam processing of waveguides
Host: Manuela Lötsch
13-03-2025 10:15 - 11:00
Available meetings:  2
Requested meetings:  0
Request meeting
2. Glass-Silicon E/O Interposers
Host: Giovanni Delrosso
13-03-2025 10:15 - 11:00
FULL
5. PIC packaging
Host: Nikola Prtljaga
13-03-2025 10:15 - 11:00
FULL
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